Electroless Copper Plating
Electroless copper plating is a process in circuit board manufacturing, commonly known as copper deposition or pore forming (PTH), which is a self catalytic oxidation-reduction reaction. Firstly, an activator is used to adsorb a layer of active particles on the surface of the insulating substrate. Typically, palladium metal particles are used (palladium is a very expensive metal that is expensive
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